Method of manufacturing semiconductor wafer
US6753256B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2001 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Aug 2, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An object of the present invention is to provide a method of manufacturing a semiconductor wafer in which the manufacturing efficiency of grinding using a double-headed grinding machine is improved, minute surface undulations arising through the grinding are reduced, and the yield of the manufacturing process is improved. By processing a sliced wafer using a double-headed grinding machine, a strained layer and a macroscopic undulation component formed on the wafer surfaces during the slicing are removed, and the degree of flatness of the wafer is improved, and by subsequently carrying out both-surfaces lapping, minute surface undulations that arose during the double-headed grinding are removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.