Tomohiro Hashii
20Patents
3h-index
17Co-inventors
60Inventor score
Filing activity: Jun 16, 2000 → Dec 20, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6465328B1 | Semiconductor wafer manufacturing method | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6753256B2 | Method of manufacturing semiconductor wafer | Performing Operations; Transporting | 3 | Expired |
| US7601644B2 | Method for manufacturing silicon wafers | Electricity | 3 | Expired |
| US7488400B2 | Apparatus for etching wafer by single-wafer process | Emerging Cross-Sectional Technologies | 3 | Active |
| US8092277B2 | Method of grinding semiconductor wafers, grinding surface plate, and grinding device | Performing Operations; Transporting | 2 | Active |
| US7906438B2 | Single wafer etching method | Electricity | 2 | Active |
| US8466071B2 | Method for etching single wafer | Electricity | 2 | Active |
| US8759229B2 | Method for manufacturing epitaxial wafer | Electricity | 1 | Active |
| US6969302B1 | Semiconductor wafer grinding method | Performing Operations; Transporting | 1 | Expired |
| US7288207B2 | Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same | Chemistry; Metallurgy | 1 | Expired |
| US12406863B2 | Wafer separation apparatus and method, and method for manufacturing silicon wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US7955982B2 | Method for smoothing wafer surface and apparatus used therefor | Electricity | 0 | Active |
| US9550264B2 | Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer | Electricity | 0 | Active |
| US7717768B2 | Wafer polishing apparatus and method for polishing wafers | Electricity | 0 | Expired |
| US11456168B2 | Method of lapping semiconductor wafer and semiconductor wafer | Electricity | 0 | Active |
| US9881783B2 | Method for processing semiconductor wafer | Performing Operations; Transporting | 0 | Active |
| US7648890B2 | Process for producing silicon wafer | Electricity | 0 | Active |
| US9017145B2 | Polishing solution distribution apparatus and polishing apparatus having the same | Performing Operations; Transporting | 0 | Active |
| US8066896B2 | Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US9324558B2 | Machining process for semiconductor wafer | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.