Heat activated adhesive
US6753379B1 · kind B1 · utility
32Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2002 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Apr 19, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides thermally activated adhesive compositions comprising polymer and polyester wherein the adhesive polymer comprises a polymer having hydroxyl and phenyl groups and adhesive films made from the adhesive compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.