Printed circuit board having permanent solder mask
US6753480B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2002 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Jun 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board having a permanent solder mask includes a substrate made of a glassfiber reinforced epoxy resin material. The top and bottom surfaces of the substrate are disposed thereon a conductive pattern respectively. An epoxy resin solder mask is coated on each surface of the substrate in such a way that the conductive pattern is divided into a sheltered portion covered by the solder mask and an unsheltered portion exposed outside. The solder mask also has an even and smooth outer surface with a micro-roughness ranging between 0.5 &mgr;m˜10 &mgr;m and an optimum thickness ranging between 2 &mgr;m˜200 &mgr;m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.