Interconnect package cluster probe short removal apparatus and method
US6753688B2 · kind B2 · utility
0Cited by
16References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2001 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Jun 4, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2805
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and structure for an electronic circuit test and repair apparatus includes both of at least one wiring analyzer to locate circuit shorts and a current source to provide current sufficient to attempt to remove any identified shorts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.