Robert N. Wiggin
3Patents
1h-index
9Co-inventors
30Inventor score
Filing activity: Jun 30, 1998 → Apr 10, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6391669B1 | Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices | Emerging Cross-Sectional Technologies | 32 | Expired |
| US6429672B2 | Contamination-tolerant electrical test probe | Physics | 0 | Expired |
| US6753688B2 | Interconnect package cluster probe short removal apparatus and method | Physics | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.