Printed circuit board having jumper lines and the method for making said printed circuit board
US6753746B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2001 |
| Grant date | Jun 22, 2004 |
| Priority date | — |
| Expiry date | Jan 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention relates a printed circuit board having jumper lines, and a method for making the printed circuit board. An isolation layer made of a dielectric material is coated on the line layer of the printed circuit board, and multiple pads are formed in the isolation layer, thereby exposing part of the line layer without covered by the isolation layer. A high conductive material is coated on the isolation layer to connect the multiple pads, thereby forming a planar jumper layer that is connected to the line layer through the circular pads. Thus, the planar jumper layer may be made simultaneously during fabrication of the printed circuit board, without having to perform the wire-bonding work.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.