Plasma processing system and apparatus and a sample processing method
US6755932B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2001 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Feb 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32972
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The object of the present invention is to provide a plasma processing apparatus wherein plasma is generated in process chamber to treat a sample. Said plasma processing apparatus is further characterized in that multiple closely packed through-holes are formed on the plate installed on the UHF antenna arranged opposite to the sample, an optical transmitter is installed almost in contact with the back of the through-holes, and an optical transmission means is arranged on the other end of said optical transmitter, thereby measuring optical information coming from the sample and plasma through optical transmitter and optical transmission means by means of a measuring instrument. No abnormal discharge or particle contamination occur to through-holes even in long-term discharge process, and no deterioration occurs to the optical performance at the end face of the optical transmitter. Said plasma processing apparatus ensures stable and high precision measurement of the state of the surface of sample and plasma for a long time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.