Titanium target for sputtering
US6755948B1 · kind B1 · utility
23Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2002 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Jul 12, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C14/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A titanium sputtering target that contains a concentration of oxygen in an amount of 20 ppm or less and has a maximum grain diameter of 20 &mgr;m or less. The target permits a sputtering operation to be accomplished substantially free from the formation of particles or the occurrence of an abnormal discharge phenomenon. In addition, the target contains a reduced amount of contaminants and is soft.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.