Semiconductor wafer dividing apparatus and semiconductor device manufacturing method
US6756562B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2003 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Mar 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6834
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor device manufacturing apparatus includes a damage forming equipment, dividing equipment and removing equipment. The damage forming equipment forms damage layers used as starting points to divide a semiconductor wafer into discrete semiconductor chips on a rear surface side of the semiconductor wafer which is opposite to an element forming surface. The dividing equipment divides the semiconductor wafer into discrete semiconductor chips with the damage layers used as the starting points. The removing equipment removes a rear surface portion of the semiconductor wafer to at least a depth where the damage layers are no more present.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.