Patent · US Expired

Probe tip and method of manufacturing probe tips by peel-off

US6756584B2 · kind B2 · utility

6Cited by

1References

18Claims

0Family size

Assignee

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW · BE

Inventors

Thomas Hantschel · Houtvenne, BE
Wilfried Vandervorst · Mechelen, BE

Key dates

Filing date	Sep 12, 2001
Grant date	Jun 29, 2004
Priority date	—
Expiry date	Dec 4, 2021

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S977/875
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A full metal probe and a method of making the metal probe for electrical atomic force microscopy. In one embodiment, the method comprises manufacturing the full metal probe using two lithography steps. The step of etching thin membranes is dropped or eliminated to substantially reduce the processing time. Thus, topside processing is sufficient. The probe and tip can be peeled off from the wafer using a metallization procedure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.