Power device having multi-chip package structure
US6756689B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2003 |
| Grant date | Jun 29, 2004 |
| Priority date | — |
| Expiry date | Jan 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power device having a multi-chip package structure and a manufacturing method therefor are provided. In the power device, a transistor, which is a switching device, and a control integrated circuit (IC) chip, which is a driving device, are mounted together in a package, thereby requiring a high insulation withstand voltage between the transistor chip and the control IC chip. The power device and the manufacturing method can simplify a packaging process by attaching the control IC chip on a chip pad of a lead frame using an insulating adhesive tape at a level with the transistor chip. Furthermore, the overall size of a package in the power device can be reduced by attaching the control IC chip on top of the transistor chip using the insulating adhesive tape. In the case of attaching the control IC chip on the top of the transistor chip, a liquid non-conductive adhesive can be used instead of an insulating adhesive tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.