High speed pick and place apparatus
US6758113B2 · kind B2 · utility
14Cited by
14References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2001 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Jul 10, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T74/20305
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A pick and place apparatus comprises a bond arm adapted for rotation about an axis between a pick location and a place location. The bond arm is formed with a cavity at an end of the arm remote from the axis, within which cavity are located a plurality of damping particles for damping unwanted vibrations of the bond arm. The particles may be irregular tungsten granules with a diameter between 0.3 and 1.2 mm and a filling ratio of about 75%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.