Heat dissipating component using high conducting inserts
US6758263B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2001 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Dec 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/905
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal management system provides a heat dissipating component using a high thermal conductivity insert. The heat dissipating component may be a spreader or heat sink, and includes a planar graphite member having high thermal conductivity along the plane of the member and having a relatively low thermal conductivity through the thickness of the member. A cavity is formed through the thickness of the member and the high conductivity insert is received in the cavity. The insert may be an isotropic high thermal conductivity material such as copper or an anisotropic material such as graphite oriented to have high conductivity in the direction of the thickness of the planar element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.