Substrate polishing apparatus
US6758723B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 27, 2002 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Dec 27, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device, wherein the table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.