Soldering machine
US6761301B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 15, 2002 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Mar 21, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering machine using lead-free solders is provided which can uniformly heat a printed circuit board and electronic parts to be mounted thereon, and which can solder the electronic parts without thermally damaging them. A porous member having a number of holes formed therein is disposed between a blower fan and a heater for making uniform the pressure of a fluid. A radiation plate is disposed between the heater and a heating target for blowing the fluid having been heated by the heater to the heating target in the form of a turbulent flow. The heated fluid is blown to the heating target for heating the same, whereby solder is melted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.