Reclaiming virgin test wafers
US6761625B1 · kind B1 · utility
7Cited by
12References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2003 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | May 20, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system for reclaiming virgin test wafers by polishing a very thin layer from the wafer surface, applying a low down force between the wafer and the pad, with a dilute, low basic slurry. By polishing only a few hundred Angstroms of silicon from the wafer surface, a virgin test wafer may be repeatedly reclaimed and reused for periodic defect monitoring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.