Method for coating a semiconductor substrate with a mixture containing an adhesion promoter
US6762113B2 · kind B2 · utility
4Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2002 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Apr 26, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D175/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of coating a semiconductor substrate material with a coating material consisting of the steps of mixing an adhesion promoter with a coating material and applying the mixture to a semiconductor substrate material. The invention also includes means for coating a semiconductor substrate material with a coating material comprising means for mixing adhesion promoters with coating materials and means for applying the mixture of adhesion promoters and coating materials to a semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.