Package having array of metal pegs linked by printed circuit lines
US6762118B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2002 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Jun 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package structure having an array of metal pegs connected by printed circuit lines. The package includes a die pad having a die positioned above and an area array distribution of external metal pegs surrounding the die. The package also contains a plurality of internal metal pegs that surround the die. These internal pegs are electrically connected to the bonding pads on the die via conductive medium. The die pad, the die, the conductive medium and the internal pegs are all enclosed by an insulating material. The bottom side of the die pad is exposed while the external metal pegs are electrically connected to various internal metal pegs using printed circuit lines. Furthermore, an electroplate layer is also formed on the end face of each metal peg.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.