Methods of forming metallurgy structures for wire and solder bonding
US6762122B2 · kind B2 · utility
81Cited by
21References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2001 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Sep 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Metallurgy structures for input/output pads of an electronic devices can be adapted to receive both solder and wire bonds. First and second metallurgy structures, for example, can be provided on respective first and second input/output pads of an electronic device such that the first and second common metallurgy structures have a shared structure adapted to receive both solder and wire bonds. A solder bond can thus be applied to the first metallurgy structure, and a wire bond can be applied to the second metallurgy structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.