Wiring-connecting material and process for producing circuit board with the same
US6762249B1 · kind B1 · utility
18Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2002 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Jul 8, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.