Electro-optical package with drop-in aperture
US6762868B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2001 |
| Grant date | Jul 13, 2004 |
| Priority date | — |
| Expiry date | Nov 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A drop-in aperture 20, which improves the performance and lowers the cost of electro-optical SLM packages. The disclosed package provides a separate metal light shield (aperture) 20 and antireflective coated cover 33, and positions the aperture 20 inside the package 40 in close proximity to the SLM's 41 surface. This approach further uses an on-chip SLM light shield to define the projected screen border, thereby making the edge definition of the metal drop-in aperture less critical. Therefore, the cover can be mounted well away from the plane of the SLM, which relaxes the defect requirements of the cover and lowers the cost of the overall package. The package of this invention improves the performance and lifetime and lowers the cost of projection display systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.