Zero insertion force heat-activated retention pin
US6764325B2 · kind B2 · utility
10Cited by
3References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Jul 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/306
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate incurred due to exposure to an increasing heat profile encountered to secure the component to the substrate. A zero insertion force heat activated retention pin expands or bends during the temperature increase, creating an upward force on the printed circuit board. This upward force counters the downward sag forces and enables the carrier substrate to maintain a coplanar relationship with the component being connected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.