Methods and apparatuses for processing microfeature workpiece samples
US6764383B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2003 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | May 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/202
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and apparatuses for processing microfeature workpiece samples are disclosed herein. An apparatus in accordance with one embodiment of the invention includes a support body, a first contact surface portion, a second contact surface portion, and a sample holder configured to releasably carry the microfeature workpiece sample. The sample holder can be movable relative to the support body between a first position and a second position, wherein the sample holder has a first orientation relative to the first and second contact surface portions when in the first position and a second orientation when in the second position. At least one of the first and second contact surface portions can also be movable relative to the support body. Accordingly, an operator can move the first and/or second contact surface portions to make minor adjustments to an angle at which material is removed from the workpiece, and can move the sample holder to make more substantial adjustments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.