Semiconductor module having a configurable data width of an output bus, and a housing configuration having a semiconductor module
US6765302B2 · kind B2 · utility
0Cited by
8References
12Claims
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Key dates
| Filing date | Oct 8, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Oct 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor module having a configurable data width of an output bus has data connecting pads as well as driver circuits having a respective output that is connected to an associated data connecting pad. At least one of the data connecting pads, which is not used for interchanging data or commands during operation, is permanently connected to a connection for an internal supply voltage. Thus, in a module configuration with a reduced number of data lines being used, the remaining data lines can be operated at an increased frequency, since the signal-to-ground ratio is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.