Mask/wafer control structure and algorithm for placement
US6766507B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2002 |
| Grant date | Jul 20, 2004 |
| Priority date | — |
| Expiry date | Jun 15, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70683
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A mask/wafer control structure and an algorithm for placement thereof provide for data placement of measurement control structures, called a PLS, Process limiting Structure, on a mask and a plurality of chips on the wafer which provide for tighter control of both mask manufacture and wafer production by providing the most critical design structures for measurement during creation of the mask, and in the photolithography and etch processes. The PLS structures are located at multiple locations throughout the chip, and so they receive the same data preparation as the chip, and measurement tools are able to measure the same features at each fabrication step from fabrication of the mask to final formation of the etched features. Manufacturing control and the interlock between the wafer fabrication and the mask fabrication are enhanced, allowing for improved quality of the final product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.