Apparatus and method for cleaning a wafer
US6766813B1 · kind B1 · utility
6Cited by
23References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2000 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Aug 1, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention provides a method of cleaning a wafer. The method comprises suspending the wafer beneath a vacuum chuck. The vacuum chuck contains an acoustic wave emitter. The acoustic wave emitter is positioned within the vacuum chuck to prevent the acoustic wave emitter from contacting the surface of the wafer. The method further comprises applying acoustic waves to the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.