Apparatus and method of placing solder balls onto a substrate
US6766938B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2002 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Jan 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides an apparatus and method for positioning solder balls in a desired array on a substrate. A positioning means is provided for positioning the solder balls in positions corresponding to the array of positions the solder balls are to take up on the substrate. A container for receiving a plurality of solder balls and which is movable between a first position remote from the positioning means and a second position directly thereover supplies solder balls to the positioning means. Means are provided to bias the solder balls in the direction of movement of the container from the first to the second position whereby to reduce or obviate damage to the solder balls during such movement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.