Method for sealing fine groove with siliceous material and substrate having siliceous coating formed thereon
US6767641B1 · kind B1 · utility
23Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2002 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Oct 23, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for sealing a fine groove with a siliceous material, characterized as comprising applying a solution of a perhydropolysilazane having a weight average molecular weight in the range of 3,000 to 20,000 in terms of polystyrene to a substrate having at least one groove having a width of 0.2 &mgr;m or less at its deepest portion and having a ratio of the corresponding depth to the width of 2 or more, to thereby fill and seal the groove with the perhydropolysilazane, and then heating the perhydropolysilazane in an atmosphere containing water vapor to thereby convert the perhydropolysilazane to a siliceous material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.