Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
US6767840B1 · kind B1 · utility
18Cited by
24References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2000 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Nov 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30608
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultrasonic bath (30) is arranged below a wafer processing bath (10). Wafers (40) are processed while ultrasonic waves are transmitted from the ultrasonic bath (30) to the wafer processing bath (10). The wafers (40) are processed while being entirely dipped into the wafer processing bath (10) and rotated by wafer rotating rods (53).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.