Method of securing a substrate in a semiconductor processing machine
US6767846B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2003 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Jul 2, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/907
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of securing a substrate in a semiconductor processing machine. The method includes moving latch bodies between latched and unlatched positions while permitting contact between a clamping member of each latch body and the substrate only if the latch bodies are substantially in the latched position. In the latched position, the clamping members apply a clamping force effective to secure the substrate. Generally, contact is prevented by engagement between a support member and an ramp that is inclined such that the clamping member descends toward the substrate as the latch body moves from the unlatched position to the latched position and only contacts the substrate as the latched position is established.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.