Organic substrate for flip chip bonding
US6768206B2 · kind B2 · utility
12Cited by
22References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 7, 2002 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | May 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An exemplary embodiment of the present invention described and shown in the specification and drawings is a substrate that has lattice points and interstitial points. The substrate includes a surface, a plurality pads located on the surface at interstitial points, and a plurality of vias located in the substrate only at lattice points.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.