Defect inspecting device for substrate to be processed and method of manufacturing semiconductor device
US6768542B2 · kind B2 · utility
8Cited by
7References
11Claims
0Family size
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Key dates
| Filing date | Aug 16, 2002 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Sep 14, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9503
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A defect inspecting device for a wafer is built in a positioning device for positioning a wafer 1, as a substrate to be processed, in a semiconductor manufacturing process. Light is irradiated on the wafer held on a vacuum holding base 2 while rotating the wafer at least one rotation from a position where the wafer is positioned and the scattered light is received. An operation unit 14 and a control unit 15 judge that if the intensity of the scattered light exceeds a predetermined threshold, a defect is detected on the wafer 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.