Electrostatic chuck and processing apparatus for insulative substrate
US6768627B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 11, 2002 |
| Grant date | Jul 27, 2004 |
| Priority date | — |
| Expiry date | Feb 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
According to the present invention, there is provided an electrostatic chuck for electrostatically attracting an insulative substrate, an apparatus for heating/cooling an insulative substrate using the electrostatic chuck, and a method for controlling the temperature of an insulative substrate. The shape and the properties of the dielectric, and the shape of the electrodes, which form the electrostatic chuck, are disclosed. Also the apparatus for heating/cooling an insulative substrate comprising a plate, a gas supply conduit and a temperature controlling system, and the apparatus for processing an insulative substrate in which the apparatus for heating/cooling an insulative substrate is installed are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.