Fluid flow system
US6769463B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 16, 2002 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Jun 25, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/87885
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
The present application relates to fluid flow systems and more particularly to fluid flow systems for use in the semiconductor industry. In one embodiment, the present invention is directed to a fluid stick adapted to be mounted to a mounting surface. The fluid stick includes a first flow component positioned in the fluid stick and a second flow component positioned in the fluid stick between the first flow component and the mounting surface and in fluid connection with the first flow component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.