High frequency device packages and methods
US6770822B2 · kind B2 · utility
76Cited by
34References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2002 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Feb 22, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53874
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high frequency device packing method and package are described wherein coaxial structures are formed from the high frequency device to the via. A coaxial via structure and a micro-coaxial bonding wire are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.