Sean S. Cahill
31Patents
10h-index
23Co-inventors
75Inventor score
Filing activity: Jun 3, 1993 → Feb 10, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6229190A | Compensated semiconductor pressure sensor | Electricity | 121 | Expired |
| US5393647A | Method of making superhard tips for micro-probe microscopy and field emission | Electricity | 118 | Expired |
| US6351996B1 | Hermetic packaging for semiconductor pressure sensors | Physics | 96 | Expired |
| US6770822B2 | High frequency device packages and methods | Emerging Cross-Sectional Technologies | 76 | Expired |
| US5444244A | Piezoresistive cantilever with integral tip for scanning probe microscope | Emerging Cross-Sectional Technologies | 62 | Expired |
| US6346742B1 | Chip-scale packaged pressure sensor | Electricity | 55 | Expired |
| US6006607A | Piezoresistive pressure sensor with sculpted diaphragm | Physics | 48 | Expired |
| US5802911A | Semiconductor layer pressure switch | Electricity | 13 | Expired |
| US6058027A | Micromachined circuit elements driven by micromachined DC-to-DC converter on a common substrate | Electricity | 13 | Expired |
| US5604313A | Varying apparent mass accelerometer | Physics | 12 | Expired |
| US7047814B2 | Micro-electromechanical sensor | Physics | 10 | Expired |
| US6667549B2 | Micro circuits with a sculpted ground plane | Electricity | 8 | Expired |
| US7305890B2 | Micro-electromechanical sensor | Physics | 8 | Expired |
| US5545594A | Semiconductor sensor anodic-bonding process, wherein bonding of corrugation is prevented | Physics | 6 | Expired |
| US5644086A | Preloaded linear beam vibration sensor | Physics | 5 | Expired |
| US5528070A | Semiconductor sensor manufactured through anodic-bonding process | Physics | 3 | Expired |
| US5484745A | Method for forming a semiconductor sensor | Emerging Cross-Sectional Technologies | 3 | Expired |
| US5629243A | Preloaded linear beam vibration sensor and its manufacturing method | Physics | 3 | Expired |
| US8581113B2 | Low cost high frequency device package and methods | Emerging Cross-Sectional Technologies | 2 | Active |
| US7520054B2 | Process of manufacturing high frequency device packages | Emerging Cross-Sectional Technologies | 2 | Expired |
| US8839508B2 | Method of making a high frequency device package | Emerging Cross-Sectional Technologies | 2 | Active |
| US9523977B2 | Barcode menu structure advancement | Physics | 1 | Active |
| US9859188B2 | Heat isolation structures for high bandwidth interconnects | Electricity | 1 | Active |
| US9711479B2 | Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same | Electricity | 0 | Active |
| US9673137B2 | Electronic device having a lead with selectively modified electrical properties | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.