Testing circuits on substrates
US6771060B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2001 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Jun 4, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/311
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.