Systems having modules with on die terminations
US6771515B2 · kind B2 · utility
16Cited by
37References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2001 |
| Grant date | Aug 3, 2004 |
| Priority date | — |
| Expiry date | Jan 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10022
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In some embodiments, the invention includes a system having first and second modules and a circuit board including first and second module connectors to receive the first and second modules, respectively. A first path of conductors extends from the circuit board to the first module connector, to the first module, back to the first module connector, to the circuit board, to the second module connector and to the second module. The first path couples to chips of the first and second modules, and each of the chips include on die terminations, but only some of the chips include on die terminations that are enabled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.