Confocal 3D inspection system and process
US6773935B2 · kind B2 · utility
10Cited by
31References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2002 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Jul 16, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B21/16
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.