Chip pickup device and method of manufacturing semiconductor device
US6774011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2001 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Aug 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68318
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pickup device comprises a thrusting mechanism, a carrying mechanism and a controller. The thrusting mechanism is configured to thrust the chips sequentially by using pins from a back side of the adhesive tape with the adhesive tape between the chips and the pins so as to peel the chips off the adhesive tape. The carrying mechanism is configured to sequentially absorb the chips with use of a collet, hold the chips to be absorbed until the chips are peeled off the adhesive tape, thereafter pick the chips up by ascending the collet in order to be carried the chips to a subsequent process stage. The controller is configured to controlling the thrust of the chip by thrusting mechanism, the controller control an ascend time and a descend time of the pins, and keeping a predetermined period of a time when the pins arrive at their peak.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.