Surface mount connector lead
US6774310B1 · kind B1 · utility
5Cited by
7References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2000 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Dec 8, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An enhanced joint thickness lead used for surface mounting electronic devices to a substrate, wherein a portion of the enhanced joint thickness lead that is substantially parallel to the substance. The enhanced joint thickness lead includes an arcuate structure, which provides an enhanced joint thickness for the solder used to connect the lead to the substrate. The enhanced joint thickness of the solder results in a more robust attachment of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.