Hermetic sealing of target/backing plate assemblies using electron beam melted indium or tin
US6774339B1 · kind B1 · utility
12Cited by
16References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2002 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Sep 7, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The interfacial joint area of a target/backing plate assembly is sealed so as to inhibit the migration of air and/or water vapor that may be present or trapped along the interfacial surfaces. A pool or bead of molten solder is placed along the interfacial joint and moved continuously around the full 360° circumference of the assembly so as to cover and seal the boundary area. The solder is melted, preferably, by e-beam welding in a vacuum or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.