Semiconductor power package module
US6774465B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2002 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Oct 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor power module in which a power circuit chip and a control circuit chip are integrated in a package, is provided. The semiconductor power module includes a case; a terminal inserted into the case, the terminal including portions protruding upward to the outside of the case, and portions exposed in the case; a first substrate to which the power circuit chip is attached, the first substrate attached to the case for encapsulating the bottom of the package; a second substrate to which the control circuit chip is attached, the second substrate being spaced from the first substrate at a predetermined interval in a perpendicular direction in the case; and a cover for covering the top of the case, and for encapsulating the top of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.