Semiconductor device
US6774466B1 · kind B1 · utility
78Cited by
8References
2Claims
0Family size
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Key dates
| Filing date | Jan 28, 2000 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Jan 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/601
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.