Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device
US6774479B2 · kind B2 · utility
10Cited by
9References
51Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2002 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | May 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to an electronic device having a semiconductor chip and a leadframe. The leadframe has a flat conductor frame. A semiconductor chip connection plate is configured in the center of the flat conductor frame. The semiconductor chip connection plate is structured by elongate openings all around the position of the semiconductor chip to form an island that carries the semiconductor chip and a ring that surrounds the island. Furthermore, the invention relates to a method for producing such an electronic device and to a corresponding leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.