Non-leaded semiconductor package and method of fabricating the same
US6774499B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 13, 2003 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | May 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A non-leaded semiconductor package and method of fabricating the same is proposed, which can be used for the fabrication of a non-leaded type of semiconductor package, such as a CQFN (Carrierless Quad Flat No-lead) package. The proposed semiconductor packaging technology is characterized by the use of a metal plate as provisional chip carrier during fabrication and by the use of RDL (Redistribution Layer) technology to provide internal electrical interconnections between the I/O pads of the packaged chip and the non-leaded external electrical contacts. These features allow the fabrication of the CQFN package to be implemented without the use of bonding wires for internal electrical connections and without the use of substrate as a permanent chip carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.