Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
US6775150B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2000 |
| Grant date | Aug 10, 2004 |
| Priority date | — |
| Expiry date | Sep 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid substrate. In one embodiment, a ceramic portion of the substrate includes at least one capacitor formed of a high permittivity layer sandwiched between conductive planes. An organic portion of the substrate includes suitable routing and fan-out of power and signal conductors. The organic portion includes a build-up of multiple layers of organic material overlying the ceramic portion. Also described are an electronic system, a data processing system, and various methods of manufacture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.