Paul H. Wermer
12Patents
8h-index
7Co-inventors
57Inventor score
Filing activity: Dec 28, 1999 → Aug 22, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6555906B2 | Microelectronic package having a bumpless laminated interconnection layer | Electricity | 187 | Expired |
| US7067356B2 | Method of fabricating microelectronic package having a bumpless laminated interconnection layer | Electricity | 61 | Expired |
| US6840777B2 | Solderless electronics packaging | Emerging Cross-Sectional Technologies | 60 | Expired |
| US6605551B2 | Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance | Electricity | 44 | Expired |
| US6775150B1 | Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture | Electricity | 33 | Expired |
| US6829133B2 | Capacitor | Electricity | 21 | Expired |
| US7120031B2 | Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors | Electricity | 14 | Expired |
| US7159313B2 | Solderless electronics packaging and methods of manufacture | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7136275B2 | Polymeric dielectric material for high-energy density capacitors | Electricity | 7 | Expired |
| US7535728B2 | Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors | Electricity | 5 | Active |
| US6480370B1 | Polymeric dielectric material for high-energy density capacitors | Electricity | 5 | Expired |
| US7348496B2 | Circuit board with organic dielectric layer | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.