Method and device for thermally treating objects

US6775471B2 · kind B2 · utility

Assignee

• Mattson Thermal Products GmbH · US

Inventors

• Werner Blersch · Bußmannshausen, DE
• Jochen Urban · Neu-Ulm, DE
• Silke Paul · Ulm, DE
• Uwe Ruby · Blaustein, DE
• Markus Hauf · Ulm, DE

Key dates

• Filing date: Mar 5, 2003
• Grant date: Aug 10, 2004
• Expiry date: Mar 5, 2023

Classification

• Technology area (CPC G): Physics
• CPC primary: G05D23/1917
• WIPO field: Control
• WIPO sector: Instruments

Abstract

The invention relates to a method and to a device for thermally treating objects. The aim of the invention is to facilitate a better control of the temperature profile of an object to be thermally treated. To this end, the invention provides a method and a device for thermally treating an object in a heating system, especially for treating semiconductor wafers (2) in a rapid heating system (1). The objects are thermally treated at a predetermined temperature progression and the temperature of the object is controlled via a PID control and a feedforward control that are based on a simulation model of the heating system and the object. Said model consists of individual models of components of the heating system and/or the object. The parameters of at least one of the individual models are monitored during the thermal treatment and the model is adapted to the monitored parameters.